Hamamatsu Photonics is constructing a new facility to meet the growing demand for opto-semiconductor products at its main factory site located in Ichino-cho, Higashi-ku, Hamamatsu City in Japan to handle pre-processing steps in the manufacture of opto-semiconductors.
The groundbreaking ceremony for the new factory building was held on Friday 30th June, and the new factory building is scheduled for completion in June 2025.
Hamamatsu Photonics has been supplying opto-semiconductor products for a range of fields including medical, industrial, and automotive applications.
Constructing this new factory building will nearly double the company’s production space. Besides its current production lines for conventional 6-inch silicon wafers, Hamamatsu will be running a production line compatible with 8-inch diameter wafers in the new factory building to ensure production continuity while streamlining production and cutting costs. The new factory building's cleanroom will be connected to the existing factory building's cleanroom via a clean passage. This will allow the smooth movement of people and materials as well as automate the manufacturing process and save workforce time thanks to an automated conveyor system.
The new factory building makes use of an earthquake-resistant structure for better resilience in responding to natural disasters and will also include eco-friendly manufacturing equipment.
